PCB-x00 Pitch Changing Back-to Back

PCB-x00

• Transfers 24 to 26 wafers between one standard pitch plastic cassette and one custom process boat in a contact back-to-back configuration.
• Configurable to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers.
• Machine interface is a 12 key pad with a 4 line LCD Display.
• Designed to limit particle contamination by using lead screw drive and stepper motor, clean room grade rails and bearings and electric boat sensors.
• All aluminum parts are hard black anodized for corrosion resistance.
• Electronic through beam sensors are used to detect wafer presence in boats and retainers thus preventing accidental double loading and scratches.
• Lift system uses ramped speed controls for gentle pick-up and landing.
• Pressure sensors are used for both personal safety and machine safety by inhibiting machine operation.
• Machine will not drop wafers in the event of a power failure and will prompt the operator through the “Recovery Mode” after power has been restored.
• A “Technician Mode” is provided to facilitate preventative maintenance.