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Thermalcouple Wafer (TC Wafer)

Semiconductor Equipment and Consumables

Unlike typical TC Wafer solution we provide one that watches temperature from inside the wafer instead of outside the wafer. This unique approach provide realistic and accurate temperature information which enable precise control of the temperature to ensure quality and consistency in performance. Coupling with advance portable data logging device these unique combination makes our solution the choice for wafer fabrication house in temperature quality control. Target Application: Vacuum Chamber/Oven type Specifications: Wafer Size:?2″ – 12″ Thermalcouples: Temperature range 0 degree – 800 degree Number of Sensors:?1 – 34. TC Type:?K, R, etc TC Connector:?2 pin, D type, U Shape

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Non-Contact Thickness Measuring System

Optical Inspection and MetrologySemiconductor Equipment and Consumables

THS 20 THS series is a non-contact thickness/height/depth measuring system based on an optical type focal point detection method, incorporating the two microscope optical systems of the top and bottom, with precise focus indicator using index graticule. Thickness can be measured up to 10mm with observing the surface of measuring point. Because of an optical system, operations are simple, and the precise focus indicator (Target Mark) can be seen on a monitor at a just focus condition. THS-20 is an automatic system combining auto focus and pulse stage. X, Y or Z coordinate position, pitch feed, etc. by pulse motor drive are measured in sequential operation. Adopting image processing auto focus, high-reliable repeatability is achieved without individual differences. Also incorporating leading-edge technology, user-friendliness has been improved by Windows’ base user interface. (user-friendliness improved by Windows version)

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CDE ResMap 178

Semiconductor Equipment and Consumables

The CDE 4 point probe (4pp) ResMap 178 is a precision instrument for measuring the sheet resistivity of a conductive media (metal and semiconductor applications). It has become an industry standard for cost effective resistivity measurement. Designed to meet the needs of process development and tool characterization engineers, this four point probe has the accuracy, repeatability and reliability required. Its large installed base is testimony to its performance, ease of use and low cost of ownership. As a commonly used metrology unit in nanofabrication processes to characterize the thin film electrical properties, the tools capabilities include: 1) Sample size: 10mm to 150mm in diameter 2) Measurement range, 5mΩ to 5 MΩ 3) Accuracy: within 1% 4) Software: easy to use, mapping capability (2D and 3D contour) 5) Fast measurement and easy operation

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